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PCN/EOL Systems: 介绍了美光产品的变更通知和寿命终结系统。
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CSN-12
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2012/04
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79.21 KB
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客服要点
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Wafer Packaging and Packaging Materials: 提供了有关装运美光产品时使用的各种材料的完整装运和回收信息。
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CSN-20
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2011/09
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776.24 KB
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Bare Die SiPs and MCMs: 描述了 Bare Die SiP 和 MCM 的设计考虑因素。
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CSN-18
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2009/04
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151.06 KB
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Shipping Quantities: 提供了料件数量表格。
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CSN-04
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2012/04
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472.27 KB
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Micron KGD Definitions: 描述了美光 KGD-C1 和 KGD-C2 DRAM 芯片的测试规格和参数
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CSN-22
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2009/07
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65.52 KB
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Proper Handling Procedures for Modules: 涵盖了如何正确操作模块的程序。
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CSN-23
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2007/12
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1.02 MB
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客服要点
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Micron Component and Module Packaging: 解释了美光的封装标签和程序。
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CSN-16
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2012/02
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887.13 KB
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ESD Precautions for Die/Wafer Handling and Assembly: 介绍了在工作场所中控制 ESD 的好处，包括提高产量和改善质量与可靠性，最终可以缩减制造成本。
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CSN-24
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2010/08
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119.08 KB
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Electronic Data Interchange: 描述了 EDI 传输的装置、协议和联系方式。
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CSN-06
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2005/09
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53.5 KB
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RMA Procedures for Packaged Product and Bare Die Devices: 概括介绍了标准的退货授权 (RMA) 程序，以及与 bare die RMA 的对比。
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CSN-07
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2010/10
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82.64 KB
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ISO System Management Standards: 描述了 ISO 系统管理标准。
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CSN-08
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2004/04
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39.18 KB
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300mm Back Side Wafer ID: This document describes the back side scribe used on 300mm wafers and Micron's procedure for reading and storing that identification.
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CSN-27
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2008/11
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65.49 KB
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客服要点
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PoP User Guide: Provides several well-established guidelines for package-on-package (PoP) semiconductor package design and assembly, which requires unique considerations in both the up-front design and the manufacturing process.
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CSN-34
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2011/08
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846.18 KB
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Lead Frame Package User Guidelines: Discusses Micron's lead-frame package options
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CSN-30
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2011/05
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245.66 KB
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Proper Handling Procedures for WQVGA Display Panels: Micron WQVGA display panels must be handled according to specific procedures at all times.Maintaining proper conditions, and using proper precautions, handling techniques, and cleaning methods will help ensure prolonged, reliable operation of your WQVGA display panel products.
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CSN-32
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2011/06
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657.79 KB
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Proper Handling Procedures for qHD Display Panels: Micron qHD display panels must be handled according to specific procedures at all times.Maintaining proper conditions, and using proper precautions, handling techniques, and cleaning methods will help ensure prolonged, reliable operation of your qHD display panel products.
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CSN-31
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2011/06
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2.97 MB
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客服要点
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Micron BGA Manufacturer's User Guide: 提供相关信息，帮助顾客轻松将最前沿的和传统的美光球栅阵列 (BGA) 封装整合到制造流程中。此指南旨在提供一系列高水平指导，并附有参考手册，其中介绍了封装相关和制造工艺流程的典型做法。
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CSN-33
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2011/07
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353.32 KB
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Microdisplay RMA Policy and Procedures: Explains the RMA policy and procedures for Micron's Microdisplay products.
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CSN-29
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2011/10
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68.33 KB
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Product Marks/Product and Packaging Labels: 介绍了产品料件的标记，以及产品和封装的标签。
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CSN-11
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2012/04
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724.89 KB
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Proper Handling Procedures for Micron E330 Projection Engines: MicronE330 Projection Engines must be handled according to specific procedures at all times.Maintaining proper conditions, and using proper precautions, handling techniques, and cleaning methods will help ensure prolonged, reliable operation of your E330 projection engines.
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CSN-35
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2012/03
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456.26 KB
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