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Thermal Applications: 定义了测量和确保美光零件和模块不超过允许的最高温度的一般方法和标准
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TN-00-08
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2010/05
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252.18 KB
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技术要点
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SSD Part Numbering System: Part numbering guide for Micron SSD products.
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2012/02
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25.62 KB
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料件编号向导
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History of Digital Storage: This paper surveys the memory storage landscape of the past 50 years starting at the beginning of digital storage and paying homage to IBM™'s groundbreaking RAMAC disk storage unit and StorageTek™'s DRAM-based SSD; then enumerating the benefits of modern NAND Flash memory and advanced SSDs; and finally looking forward to the near-future possibilities of nonvolatile storage.
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White Paper
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2009/12
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739.09 KB
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White Paper
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Embedded Memory Simplifies High-Capacity Storage: This paper surveys the memory storage landscape of the past 50 years starting at the beginning of digital storage and paying homage to IBM™'s groundbreaking RAMAC disk storage unit and StorageTek™'s DRAM-based SSD; then enumerating the benefits of modern NAND Flash memory and advanced SSDs; and finally looking forward to the near-future possibilities of nonvolatile storage.
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White Paper
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2009/12
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212.64 KB
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White Paper
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PCN/EOL Systems: 介绍了美光产品的变更通知和寿命终结系统。
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CSN-12
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2012/04
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79.21 KB
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客服要点
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Wafer Packaging and Packaging Materials: 提供了有关装运美光产品时使用的各种材料的完整装运和回收信息。
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CSN-20
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2011/09
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776.24 KB
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客服要点
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Bare Die SiPs and MCMs: 描述了 Bare Die SiP 和 MCM 的设计考虑因素。
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CSN-18
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2009/04
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151.06 KB
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客服要点
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Shipping Quantities: 提供了料件数量表格。
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CSN-04
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2012/04
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472.27 KB
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客服要点
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Micron KGD Definitions: 描述了美光 KGD-C1 和 KGD-C2 DRAM 芯片的测试规格和参数
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CSN-22
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2009/07
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65.52 KB
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客服要点
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Micron Component and Module Packaging: 解释了美光的封装标签和程序。
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CSN-16
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2012/02
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887.13 KB
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客服要点
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ESD Precautions for Die/Wafer Handling and Assembly: 介绍了在工作场所中控制 ESD 的好处，包括提高产量和改善质量与可靠性，最终可以缩减制造成本。
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CSN-24
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2010/08
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119.08 KB
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客服要点
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Electronic Data Interchange: 描述了 EDI 传输的装置、协议和联系方式。
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CSN-06
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2005/09
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53.5 KB
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客服要点
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RMA Procedures for Packaged Product and Bare Die Devices: 概括介绍了标准的退货授权 (RMA) 程序，以及与 bare die RMA 的对比。
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CSN-07
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2010/10
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82.64 KB
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客服要点
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ISO System Management Standards: 描述了 ISO 系统管理标准。
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CSN-08
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2004/04
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39.18 KB
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客服要点
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SSDs:A Shift in Data Storage: Overview of advantages, products for different markets, reliability
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2009/12
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1.21 MB
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演示
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Moisture Absorption in Plastic Packages: Describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture
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TN-00-01
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2010/02
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87.26 KB
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技术要点
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The SMART Command Feature Set: TN-FD-03:The SMART Command Feature Set
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TN-FD-03
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2010/09
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485.87 KB
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技术要点
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RealSSD Embedded USB Reliability Status Reporting:
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TN-FD-02
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2010/11
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67.48 KB
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技术要点
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Putting SSDs to the Test: A recap of how Micron and Flexstar came to work together to develop and improve their own SSDs and SSD test platforms, respectively, and at the same time help move the industry forward with more reliable benchmarking.
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案例研究
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2009/12
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458.88 KB
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案例研究
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Micron BGA Manufacturer's User Guide: 提供相关信息，帮助顾客轻松将最前沿的和传统的美光球栅阵列 (BGA) 封装整合到制造流程中。此指南旨在提供一系列高水平指导，并附有参考手册，其中介绍了封装相关和制造工艺流程的典型做法。
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CSN-33
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2011/07
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353.32 KB
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客服要点
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Product Marks/Product and Packaging Labels: 介绍了产品料件的标记，以及产品和封装的标签。
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CSN-11
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2012/04
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724.89 KB
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客服要点
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e230 Firmware Update Software for Linux OS:
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TN-FD-09
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2012/01
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123.19 KB
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软件
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e230 Firmware Update Software for Windows OS:
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TN-FD-08
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2012/02
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242.85 KB
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软件
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Embedded USB Flyer: Describes the advantages of designing in Micron's rugged, reliable, cost-effective embedded USBs.
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2010/03
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191.8 KB
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产品宣传页
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Media Management in Solid State Drives:Multistep WRITE Operations: SSDs write data differently than conventional rotating hard drives (HDDs)—in a multistep process versus a single-step process.This brief examines the multistep write process for SSDs.
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Technical Marketing Brief
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2012/04
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823.8 KB
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Technical Marketing Brief
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An Overview of SSD Write Caching: This brief provides an overview of the differences in SSD behavior when write cache is enabled versus disabled.
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Technical Marketing Brief
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2012/05
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519.28 KB
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Technical Marketing Brief
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TN-FD-07:Checking the e230 eUSB Bad Block Count:
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TN-FD-07
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2012/01
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108.53 KB
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技术要点
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TN-FD-08:e230 Firmware Update Instructions for Windows OS:
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TN-FD-08
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2012/01
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129.09 KB
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技术要点
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TN-FD-09:e230 Firmware Update Instructions for Linux OS:
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TN-FD-09
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2012/01
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137.8 KB
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技术要点
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