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Thermal Applications: 定义了测量和确保美光零件和模块不超过允许的最高温度的一般方法和标准
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TN-00-08
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2010/05
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252.18 KB
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技术要点
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Recommended Soldering Parameters: 定义了美光科技公司产品的推荐连接技术和参数。
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TN-00-15
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2007/03
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69.09 KB
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技术要点
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Uprating of Semiconductors for High-Temperature Applications: 描述了与提升温度有关的问题，以及在制造环境规范之外使用零件和/或系统的相关风险
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TN-00-18
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2010/05
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428.33 KB
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技术要点
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Understanding Signal Integrity: 描述了从新产品构思直至产品寿命结束的整个过程中，如何发挥内存设计、测试和验证工具的最大优势
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TN-00-20
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2009/12
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1.52 MB
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技术要点
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PCN/EOL Systems: 介绍了美光产品的变更通知和寿命终结系统。
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CSN-12
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2012/04
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79.21 KB
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客服要点
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Wafer Packaging and Packaging Materials: 提供了有关装运美光产品时使用的各种材料的完整装运和回收信息。
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CSN-20
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2011/09
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776.24 KB
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客服要点
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Bare Die SiPs and MCMs: 描述了 Bare Die SiP 和 MCM 的设计考虑因素。
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CSN-18
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2009/04
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151.06 KB
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客服要点
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Shipping Quantities: 提供了料件数量表格。
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CSN-04
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2012/04
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472.27 KB
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客服要点
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Micron KGD Definitions: 描述了美光 KGD-C1 和 KGD-C2 DRAM 芯片的测试规格和参数
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CSN-22
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2009/07
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65.52 KB
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客服要点
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Micron Component and Module Packaging: 解释了美光的封装标签和程序。
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CSN-16
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2012/02
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887.13 KB
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客服要点
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ESD Precautions for Die/Wafer Handling and Assembly: 介绍了在工作场所中控制 ESD 的好处，包括提高产量和改善质量与可靠性，最终可以缩减制造成本。
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CSN-24
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2010/08
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119.08 KB
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客服要点
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Electronic Data Interchange: 描述了 EDI 传输的装置、协议和联系方式。
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CSN-06
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2005/09
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53.5 KB
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客服要点
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RMA Procedures for Packaged Product and Bare Die Devices: 概括介绍了标准的退货授权 (RMA) 程序，以及与 bare die RMA 的对比。
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CSN-07
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2010/10
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82.64 KB
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客服要点
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ISO System Management Standards: 描述了 ISO 系统管理标准。
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CSN-08
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2004/04
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39.18 KB
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客服要点
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Moisture Absorption in Plastic Packages: Describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture
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TN-00-01
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2010/02
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87.26 KB
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技术要点
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Accelerate Design Cycles with Simulation Models: 美光会提供必要的工具和指导，以在实际布局前对新设计进行检验。此技术要点讨论了软件模型支持、信号保真性优化和逻辑电路设计。
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TN-00-09
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2010/02
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206.91 KB
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技术要点
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Introduction to On-Board Programming with Numonyx Flash Memory: This application note describes the strengths, limitations, programming methods, and design considerations for on-board programming of NOR Flash memory devices.
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AN-624
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2010/11
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87.42 KB
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技术要点
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Simplify Manufacturing by Using Automatic-Test-Equipment for On-Board Programming: This document describes using automatic-test-equipment (ATE) to program Numonyx NOR Flash memory components on a PCB.
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AN-629
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2010/11
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440.67 KB
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技术要点
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How to Migrate from the M95 SPI EEPROM to the M25PE SPI Serial Flash: This application note describes how to migrate from the M95 family of SPI EEPROMs to the M25PE family of SPI Serial Flash memories.
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AN-2081
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2010/11
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314.02 KB
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技术要点
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Using XIP Modes in the Forte N25Q Flash Memory Device: This technical note explains how to implement eXecute in Place (XiP) functionality in an application based on the Numonyx Forte N25Q Flash memory device family.
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TN-12-07
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2011/04
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213.9 KB
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技术要点
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How to Migrate from Numonyx M25P128 130nm to 65nm Serial Flash: This application note explains how to migrate an application based on the Numonyx M25P128 (130nm) to Numonyx M25P128 (65nm) serial Flash memory device.
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AN-309026
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2010/11
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49.9 KB
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技术要点
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Micron Wire-Bonding Techniques: 此技术要点提供了丝焊技术的指导，可用于美光产品的镍钯 (NiPd) 和铝制接合焊盘。
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TN-00-22
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2010/11
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66.13 KB
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技术要点
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Comparing Micron N25Q and Winbond W25Q Flash Devices: Tech Note Comparing Micron N25Q and Winbond W25Q Flash Devices
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TN-12-17
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2011/07
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201.88 KB
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技术要点
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Comparing Micron N25Q and SST SST26WF Flash Devices: Tech Note Comparing Micron N25Q and SST SST26WF Flash Devices
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TN-12-16
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2011/07
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191.82 KB
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技术要点
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Comparing Micron N25Q and Spansion S25FL Flash Devices: Technical Note Comparing Micron N25Q and Spansion S25FL Flash Devices
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TN-12-15
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2011/07
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197.96 KB
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技术要点
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Comparing Micron N25Q and Macronix MX25L Flash Devices: Technical Note Comparing Micron N25Q and Macronix MX25L Flash Devices
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TN-12-14
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2011/07
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203.35 KB
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技术要点
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Comparing Micron N25Q and M25PX Flash Devices: Tech Note Comparing Micron N25Q and M25PX Flash Devices
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TN-12-13
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2011/07
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187.87 KB
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技术要点
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Comparing Micron N25Q and M25P Flash Devices: Tech Note Comparing Micron N25Q and M25P Flash Devices
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TN-12-12
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2011/07
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194.67 KB
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技术要点
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Migrating from Atmel AT45DB011D to Micron M45PE10 Flash Devices: This technical note describes the process for migrating from the Atmel Serial NOR Flash Memory device (AT45DB011D) to the Micron Serial NOR Flash memory device (M45PE10).
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TN-12-09
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2011/05
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198.99 KB
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技术要点
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Migrating N25Q 3V, 128Mb Device: This technical note explains how to migrate from the Micron® N25Q 3V, 128Mb parameter blocks serial NOR Flash device to the N25Q 3V, 128Mb uniform, subsector erase serial NOR Flash device.
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TN-12-10
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2011/06
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244.77 KB
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技术要点
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Lead Frame Package User Guidelines: Discusses Micron's lead-frame package options
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CSN-30
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2011/05
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245.66 KB
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客服要点
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Micron BGA Manufacturer's User Guide: 提供相关信息，帮助顾客轻松将最前沿的和传统的美光球栅阵列 (BGA) 封装整合到制造流程中。此指南旨在提供一系列高水平指导，并附有参考手册，其中介绍了封装相关和制造工艺流程的典型做法。
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CSN-33
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2011/07
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353.32 KB
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客服要点
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Migrating from Macronix MX25L25635E to Micron N25Q 256Mb Flash: Compares the features of the Macronix MX25L25635E and Micron N25Q (256Mb)Flash memory devices.
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TN-12-18
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2011/12
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226.89 KB
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技术要点
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Product Marks/Product and Packaging Labels: 介绍了产品料件的标记，以及产品和封装的标签。
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CSN-11
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2012/04
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724.89 KB
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客服要点
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Flash Data Integrator (FDI) File System Flyer: Running on Micron's latest NOR Flash and phase change memory (PCM), our Flash Data Integrator (FDI) file system provides dependable storage to create a compelling, low-cost solution.In addition, FDI delivers a true eXecute-in-Place (XiP) advantage in an open architecture to manage code and data in NOR and PCM memory devices.
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产品宣传页
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2011/09
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673.02 KB
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产品宣传页
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Industrial and Multi-Market Applications Flyer: 我们拥有广泛而稳定的 IMM 式存储解决方案，有助于推动汽车、工业、医疗、制造业和其它多类细分市场的技术发展。
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产品宣传页
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2011/08
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593.95 KB
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产品宣传页
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Compatibility Guide for Micron Software Device Drivers Available on micron.com: This document lists the compatible NOR, NAND, and PCM devices for the software device drivers available for download from micron.com.
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产品宣传页
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2012/02
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227.69 KB
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产品宣传页
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Serial NOR Flash Flyer: Whether you need to simplify your design with industry-standard features or develop a long-term solution for a legacy platform, our serial NOR Flash provides fast access times, secure data storage, and architectural flexibility for your product design requirements.
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产品宣传页
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2012/02
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617.12 KB
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产品宣传页
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Bypass Capacitor Selection for High-Speed Designs: 描述了高速设计的旁路电容选择。
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TN-00-06
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2011/03
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481.9 KB
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技术要点
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Password Protecting Flash Memory Blocks: This document describes a method of password protecting blocks using Micron's M29EW device as an example.
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TN-12-05
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2011/03
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404.22 KB
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技术要点
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Software Device Drivers for Micron's N25Q Serial NOR Flash Memory: This technical note provides a description of the C library source code for Micron N25Q serial NOR Flash memory devices.
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TN-12-11
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2012/02
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413.05 KB
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技术要点
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Migrating from Spansion's S25FL256S to Micron's N25Q 256Mb Flash: Compares features of Micron's 256Mb N25Q and Spansion's S25FL256S Flash memory devices
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TN-12-19
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2012/04
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243.96 KB
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技术要点
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Migrating from Macronix's MX25L25635F to Micron's N25Q 256Mb Flash Device: Migrating from Macronix's MX25L25635F to Micron's N25Q 256Mb Flash Device
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TN-12-20
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2012/05
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254.43 KB
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技术要点
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