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NAND Flash Performance Increase : Customers using the PAGE READ CACHE MODE operation provided in Micron NAND Flash devices will realize significant performance gains in systems requiring increased data volume at a much faster rate.
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TN-29-01
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2007/05
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205.94 KB
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技术要点
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Small Block vs. Large Block NAND Devices: Large-block NAND Flash devices offer significant performance increases over their small-block NAND Flash counterparts for READ, PROGRAM, and ERASE operations.
|
TN-29-07
|
2007/05
|
387.87 KB
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技术要点
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NAND Flash Security: Using Micron NAND Flash security features to implement component and code authentication security solutions, designers can protect critical system components and proprietary system software from unwanted attacks and alterations.
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TN-29-11
|
2007/05
|
189.32 KB
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技术要点
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Monitoring Ready/Busy Status in 2, 4, and 8Gb Micron NAND Flash Devices: Four options for determining the NAND Flash ready/busy device status are presented with detailed explanations of each option.
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TN-29-13
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2007/05
|
96.08 KB
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技术要点
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NAND Flash Performance Increase with PROGRAM PAGE CACHE MODE Command: This technical note discusses the benefits of PROGRAM PAGE CACHE MODE operations over normal PROGRAM PAGE operations.It also provides specific timing examples and instructions for performing PROGRAM PAGE CACHE MODE operations.Rev. C
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TN-29-14
|
2010/02
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266.14 KB
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技术要点
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Boot-from-NAND Using Micron MT28F1G08ABA NAND Flash with the Texas Instruments OMAP 2420 Processor: Describes Boot-from-NAND using Micron MT29F1G08ABA NAND Flash with the Texas Instruments OMAP 2420 processor.
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TN-29-16
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2007/06
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435.55 KB
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技术要点
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Booting from Embedded MMC: Describes booting from an embedded ARM processor in the MMC environment
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TN-29-18
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2008/06
|
282.02 KB
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技术要点
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NAND Flash 101 - An Introduction to NAND Flash and How to Design It In to Your Next Product: Provides an introduction to NAND Flash and how to design it into your next product.Rev. B
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TN-29-19
|
2010/04
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968.5 KB
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技术要点
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Improving NAND Flash Performance Using Two-Plane Command Enabled Micron Devices: Describes the performance benefits of Micron two-plane commands, and provides implementation guidelines for making the best use of two-plane capabilities
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TN-29-25
|
2008/09
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123.28 KB
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技术要点
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NAND Flash Status Register Response in Cache Programming Operations: Describes status register responses when operating in cache programming modes
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TN-29-26
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2007/06
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253.71 KB
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技术要点
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Memory Management in NAND Flash Arrays: Describes common NAND Flash memory-management methods for effective use of the NAND Flash memory array
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TN-29-28
|
2009/12
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271.42 KB
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技术要点
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Using COPYBACK Operations to Maintain Data Integrity in NAND Flash Devices: Describes how to use COPYBACK operations in NAND Flash devices
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TN-29-41
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2008/10
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101.39 KB
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技术要点
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Wear-Leveling Techniques in NAND Flash Devices: Highlights the importance of wear leveling, explains two wear-leveling techniques, and discusses implementing wear leveling
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TN-29-42
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2008/10
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268.3 KB
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技术要点
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NAND Flash Performance Improvement Using Internal Data Move: NAND data management capabilities and higher system performance through NAND Flash internal data moves
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TN-29-15
|
2010/03
|
219.17 KB
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技术要点
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IBIS Behavioral Models: 美光多年前就已成为 IBIS 开放论坛的一员，完全支持 IBIS 规范。美光的网站上提供其大部分产品的 IBIS 模型以供下载。
|
TN-00-07
|
2009/11
|
163.98 KB
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技术要点
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Thermal Applications: 定义了测量和确保美光零件和模块不超过允许的最高温度的一般方法和标准
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TN-00-08
|
2010/05
|
252.18 KB
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技术要点
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Understanding Quality and Reliability Requirements for Bare Die Applications: 介绍了 Bare Die 应用的质量和可靠性要求
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TN-00-14
|
2009/10
|
152.83 KB
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技术要点
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Recommended Soldering Parameters: 定义了美光科技公司产品的推荐连接技术和参数。
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TN-00-15
|
2007/03
|
69.09 KB
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技术要点
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Uprating of Semiconductors for High-Temperature Applications: 描述了与提升温度有关的问题，以及在制造环境规范之外使用零件和/或系统的相关风险
|
TN-00-18
|
2010/05
|
428.33 KB
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技术要点
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Understanding Signal Integrity: 描述了从新产品构思直至产品寿命结束的整个过程中，如何发挥内存设计、测试和验证工具的最大优势
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TN-00-20
|
2009/12
|
1.52 MB
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技术要点
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SEMI Wafer Map Format: 美光采用了经国际半导体设备与材料联盟 (SEMI) 批准的晶圆图文件格式。使用 SEMI 的格式，美光的客户可以放心，因为他们将始终收到规格统一、兼容、可靠的晶圆图文件。
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TN-00-21
|
2009/02
|
110 KB
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技术要点
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Thinning Considerations for Wafer Products: 有关优化晶圆薄化工艺以满足特定客户需求的信息
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TN-00-19
|
2009/10
|
73.58 KB
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技术要点
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Next-Generation NAND Flash Part Numbering System: Part numbering guide for Micron Next-Generation NAND Flash products.
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2009/08
|
35.73 KB
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料件编号向导
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Small Page SLC (128Mb - 1Gb): NAND Flash Software driver
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|
2009/11
|
9.59 KB
|
NAND Flash 软件
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Standard NAND Flash Part Numbering System: Part numbering guide for Micron Standard NAND Flash products.
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2009/02
|
28.52 KB
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料件编号向导
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Flash Memory Technology Direction: This paper explains the trade-offs associated with available disk caching methods, the differences between various types of Flash memory, and the advantages that NAND offers when superior performance is critically important.
|
White Paper
|
2009/12
|
643.16 KB
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White Paper
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PCN/EOL Systems: 介绍了美光产品的变更通知和寿命终结系统。
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CSN-12
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2012/04
|
79.21 KB
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客服要点
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Wafer Packaging and Packaging Materials: 提供了有关装运美光产品时使用的各种材料的完整装运和回收信息。
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CSN-20
|
2011/09
|
776.24 KB
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客服要点
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Bare Die SiPs and MCMs: 描述了 Bare Die SiP 和 MCM 的设计考虑因素。
|
CSN-18
|
2009/04
|
151.06 KB
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客服要点
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Shipping Quantities: 提供了料件数量表格。
|
CSN-04
|
2012/04
|
472.27 KB
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客服要点
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Micron KGD Definitions: 描述了美光 KGD-C1 和 KGD-C2 DRAM 芯片的测试规格和参数
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CSN-22
|
2009/07
|
65.52 KB
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客服要点
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Micron Component and Module Packaging: 解释了美光的封装标签和程序。
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CSN-16
|
2012/02
|
887.13 KB
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客服要点
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ESD Precautions for Die/Wafer Handling and Assembly: 介绍了在工作场所中控制 ESD 的好处，包括提高产量和改善质量与可靠性，最终可以缩减制造成本。
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CSN-24
|
2010/08
|
119.08 KB
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客服要点
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Electronic Data Interchange: 描述了 EDI 传输的装置、协议和联系方式。
|
CSN-06
|
2005/09
|
53.5 KB
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客服要点
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RMA Procedures for Packaged Product and Bare Die Devices: 概括介绍了标准的退货授权 (RMA) 程序，以及与 bare die RMA 的对比。
|
CSN-07
|
2010/10
|
82.64 KB
|
客服要点
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ISO System Management Standards: 描述了 ISO 系统管理标准。
|
CSN-08
|
2004/04
|
39.18 KB
|
客服要点
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ONFI Standards and What They Mean to Designers: Inconsistencies without ONFI and results with ONFI
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2009/12
|
166.18 KB
|
演示
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Optimizing NAND Flash Performance: Improving NAND performance in various applications
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2009/12
|
149.28 KB
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演示
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A Closer Look at NAND Flash: Exploring the possibilities of SSDs
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|
2009/12
|
2.7 MB
|
演示
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The Inconvenient Truths of NAND Flash Memory: Overview of NAND Flash
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2009/12
|
344.36 KB
|
演示
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Overcoming (or Embracing) the Dreaded Single-Source Dilemma: Multisourcing versus single-sourcing
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|
2009/12
|
241.11 KB
|
演示
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NAND Flash Reliability and Performance - The Software Effect: NAND software
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2009/12
|
296.15 KB
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演示
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Introduction to Flash Memory: Basics of Flash memory
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2009/12
|
1.11 MB
|
演示
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Power Requirements for Multi-Bit Per Cell NAND Flash: Technology differences, power consumption considerations
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2009/12
|
90.65 KB
|
演示
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3-Bit/Cell NAND Flash: Architecture, performance, endurance, system requirements, cost advantages, applications
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2009/12
|
90.87 KB
|
演示
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NAND Flash Consideratons for Consumer Applications: NAND requirements/system reliability in consumer applications
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2009/12
|
700.54 KB
|
演示
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Improving Power Budgeting Estimates in NAND Applications: Measuring Icc with better predictability
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2009/12
|
694.29 KB
|
演示
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The Many Flavors of NAND...and More to Come: Keynote for Flash Memory Summit 2009
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|
2009/12
|
8.03 MB
|
演示
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NAND Flash Architecture and Specification Trends: How to prepare for changes brought on by technology shrinks
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2009/12
|
696.58 KB
|
演示
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An ONFI Update: Overview of enhancements and the path to higher performance
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|
2009/12
|
1,007.42 KB
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演示
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Choosing the Right NAND for Your Application: Market overview, traditional versus newer devices, and Micron's broad product offering
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|
2009/12
|
2.72 MB
|
演示
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Micron® ECC Module for NAND Flash via Xilinx® Spartan™-3 FPGA: Micron® ECC module was developed and tested using Xilinx® Spartan™-3 and can be ported to certain other platforms of the user’s choosing.
|
TN-29-05
|
2007/05
|
997.75 KB
|
技术要点
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Micron® NAND Flash Controller via Xilinx® Spartan™-3 FPGA: Describes the Micron NAND Flash controller, techniques for interfacing the NAND Flash device with a processor, and use of the Micron glueless interface to interface a processor with NAND Flash memory.
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TN-29-06
|
2007/06
|
872.4 KB
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技术要点
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ONFI 2.0:High Speed NAND Overview: Discusses the limitations of the NAND interface and how ONFI 2.0 helps overcome performance limitations and provide greater scalability.Presented by Applications Engineering Manager and ONFI Technical Team Member, Michael Abraham.
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|
2007/11
|
158.84 KB
|
Webinar
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TN-29-37:Comparing 40 and 50-Series SLC NAND Flash Devices: Prior to conversion, Micron recommends that the target design take into account the product data sheet and the specific changes highlighted in this technical note.This Technical note covers the M58A, M59A & M50A products.
|
TN-29-37
|
2009/01
|
728.87 KB
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技术要点
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FBGA Date Codes: FBGA 封装零件的日期代码
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2005/08
|
22.36 KB
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料件编号向导
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Moisture Absorption in Plastic Packages: Describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture
|
TN-00-01
|
2010/02
|
87.26 KB
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技术要点
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NAND Flash Controller on Spartan-3: This technical note describes the Micron NAND Flash controller, techniques for interfacing the NAND Flash device with a processor and use of the Micron glueless interface to interface a processor with NAND Flash memory.
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TN-29-06
|
2007/06
|
872.4 KB
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技术要点
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ECC Module for Xilinx Spartan-3: Describes the Micron® ECC module that was developed and tested using Xilinx® Spartan™-3 and can be ported to certain other platforms of the user’s choosing.
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TN-29-05
|
2007/05
|
997.75 KB
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技术要点
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Accelerate Design Cycles with Simulation Models: 美光会提供必要的工具和指导，以在实际布局前对新设计进行检验。此技术要点讨论了软件模型支持、信号保真性优化和逻辑电路设计。
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TN-00-09
|
2010/02
|
206.91 KB
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技术要点
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Determining NAND Flash Ready/Busy Status: Systems that utilize NAND Flash memory can use either the ready/busy pin or the status register to determine whether a Micron® NAND Flash device is busy or ready to accept a new command.This technical note addresses the use of status register bit 5, which indicates the ready/busy status of the NAND Flash device.
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TN-29-13
|
2010/02
|
136.48 KB
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技术要点
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1-Bit Software ECC: NAND Flash software driver ECC
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|
2009/12
|
3.26 KB
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NAND Flash 软件
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TN-29-51:Migrating from 50-Series to 60-Series SLC NAND Flash Devices: Migrating from 50-Series to 60-Series SLC NAND Flash Devices; M58A, M59A, M50A, M68A, M69A, M60A
|
TN-29-51
|
2011/05
|
121.59 KB
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技术要点
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TN-29-52:Migrating 1Gb 48nm and 2Gb/4Gb 57nm SLC NAND Flash Memory to 34nm: Provides guidelines for migrating 1Gb 48nm and 2Gb/4Gb 57nm SLC, large-page NAND Flash memory to 34nm technology (M60A, M69A & M68A)
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TN-29-52
|
2010/10
|
180.46 KB
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技术要点
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TN-29-17:NAND Flash Design and Use Considerations: Describes design and use considerations for NAND Flash memory, focusing on bad-block identification and error correction.
|
TN-29-17
|
2010/09
|
226.04 KB
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技术要点
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Migrating from a Chip Enable Care to a Don't Care NAND Flash Memory: The purpose of this application note is to highlight the differences between Chip Enable don’t care and Chip Enable care devices.
|
AN2365
|
2010/10
|
265.78 KB
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技术要点
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Micron Wire-Bonding Techniques: 此技术要点提供了丝焊技术的指导，可用于美光产品的镍钯 (NiPd) 和铝制接合焊盘。
|
TN-00-22
|
2010/11
|
66.13 KB
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技术要点
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Flash + Controller Part Numbering System:
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|
2012/03
|
27.98 KB
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料件编号向导
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How ClearNAND Flash Simplifies and Enhances System Designs: Discusses NAND Flash trends and complexities; NAND interface choices; and how Micron's Enhanced ClearNAND Flash helps eliminate the impact of NAND's ever-increasing ECC requirements.
|
White Paper
|
2011/07
|
814.8 KB
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White Paper
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Micron BGA Manufacturer's User Guide: 提供相关信息，帮助顾客轻松将最前沿的和传统的美光球栅阵列 (BGA) 封装整合到制造流程中。此指南旨在提供一系列高水平指导，并附有参考手册，其中介绍了封装相关和制造工艺流程的典型做法。
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CSN-33
|
2011/07
|
353.32 KB
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客服要点
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System Benefits of EZ-NAND/Enhanced ClearNAND Flash:
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|
2011/08
|
1.77 MB
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演示
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|
FMS2011 Keynote:
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|
2011/08
|
2.41 MB
|
演示
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Current and Emerging Memory Technology Landscape:
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|
2011/08
|
2.78 MB
|
演示
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NAND Flash Comparisons for Mobile:
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|
2011/08
|
4.84 MB
|
演示
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Looking Ahead at Flash Memory:
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|
2011/08
|
6.43 MB
|
演示
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400 MT/s NAND Interface Solutions:
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|
2011/08
|
2 MB
|
演示
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Physical NAND Flash Security:
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|
2011/08
|
2.32 MB
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演示
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NAND 201:An Update on the Continued Evolution of NAND Flash: Chronicles the developments in NAND technology from 2006 through early 2011.
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White Paper
|
2011/09
|
641.28 KB
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White Paper
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NAND 霍勒斯二进制代码软件:
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|
2010/02
|
132.93 KB
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NAND Flash 软件
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Large Page SLC (1Gb, 4Gb): NAND Flash Software driver
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2010/01
|
17.27 KB
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NAND Flash 软件
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Product Marks/Product and Packaging Labels: 介绍了产品料件的标记，以及产品和封装的标签。
|
CSN-11
|
2012/04
|
724.89 KB
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客服要点
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Optimize your system designs using Flash memory:
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|
2012/04
|
6.18 MB
|
演示
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|
Industrial and Multi-Market Applications Flyer: 我们拥有广泛而稳定的 IMM 式存储解决方案，有助于推动汽车、工业、医疗、制造业和其它多类细分市场的技术发展。
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产品宣传页
|
2011/08
|
593.95 KB
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产品宣传页
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Compatibility Guide for Micron Software Device Drivers Available on micron.com: This document lists the compatible NOR, NAND, and PCM devices for the software device drivers available for download from micron.com.
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产品宣传页
|
2012/02
|
227.69 KB
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产品宣传页
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NAND Choices Flyer: A quick look at choosing the right NAND solution for your design needs
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2010/08
|
141.94 KB
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产品宣传页
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NAND Flash Flyer: Describes why Micron NAND is the best fit for your applications
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2010/08
|
145.74 KB
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产品宣传页
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NAND Flash Low Level Drivers for x16 Devices:
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|
2010/01
|
15.34 KB
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NAND Flash 软件
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Very Large Page SLC (8Gb): NAND Flash Software driver
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|
2010/03
|
10.23 KB
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NAND Flash 软件
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On-Die ECC NAND Flash Flyer: With four times or more th density of NOR, On-Die EC NAND is a great alternative to NOR for many embedded designs.
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|
2010/03
|
173.52 KB
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产品宣传页
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ONFI Flyer:
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|
2009/06
|
162.55 KB
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产品宣传页
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Serial NAND Flash Memory Flyer: Discusses advantages of Serial NAND Flash memory for embedded designs
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2009/07
|
204.25 KB
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产品宣传页
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BeagleBoard SPI NAND MTD for Linux 2.6.33: SPI NAND GPL drivers for 50 series NAND.
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2011/06
|
9.65 KB
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NAND Flash 软件
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Bypass Capacitor Selection for High-Speed Designs: 描述了高速设计的旁路电容选择。
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TN-00-06
|
2011/03
|
481.9 KB
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技术要点
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Enabling a Flash Memory Device into the Linux MTD: The technical note introduces the Linux memory technology device (MTD) architecture and provides a basis for understanding how to enable new devices and new features into the Linux MTD.
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TN-00-25
|
2011/05
|
528.81 KB
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技术要点
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Software Device Drivers for M28W640C Parallel NOR Flash Memory: This technical note describes the library source code in C for Micron's M28W640C Parallel NOR Flash Memory devices.
|
TN-13-18
|
2012/01
|
310.28 KB
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技术要点
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Hamming Codes for NAND Flash Memories: Outlines hamming codes NAND Flash memory
|
TN-29-08
|
2007/05
|
229.46 KB
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技术要点
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TN-29-56:Enabling On-Die ECC for OMAP3 on Linux/Android OS: Enabling NAND On-Die ECC for OMAP3 Using Linux/Android OS with YAFFS2.M60A, M69A, M68A.
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TN-29-56
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2010/12
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331.14 KB
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TN-29-57:Migrating from 50-Series to 60-Series SPI NAND: Supplements the product change notification (PCN) covering the transition from Micron® 50-series (50nm) to 60-series (34nm) single-level cell (SLC) SPI NAND Flash devices.
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TN-29-57
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2011/05
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164.87 KB
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TN-29-58:ONFI NV-DDR2 Design Guide: Rev. A
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TN-29-58
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2011/03
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685.04 KB
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Bad Block Management in NAND Flash Memory: This technical note explains how to recognize factory-generated bad blocks and manage bad blocks that develop during the lifetime of NAND Flash memory.
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TN-29-59
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2010/10
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317.81 KB
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Garbage Collection in SLC NAND Flash Memory: This technical note describes the recommended garbage collection algorithm to be implemented in the Flash Translation Layer (FTL) software for single-level cell (SLC) NAND Flash memory devices.
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AN1821
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2010/10
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207.37 KB
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Wear Leveling in NAND Flash Memory: This technical note describes the recommended wear leveling algorithm to be implemented in the FTL software for NAND Flash memory.
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TN-29-61
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2010/10
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213.59 KB
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Software Device Drivers for Large Page Micron NAND Flash Memory Devices: This technical note explains how to use the Micron large page NAND Flash memory software device drivers.
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TN-29-62
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2011/10
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624.45 KB
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Error Correction Code in SLC NAND Flash: This technical note describes how to implement error correction code (ECC) in Micron small page and large page single-level cell (SLC) NAND Flash memory that can detect 2-bit errors and correct 1-bit errors per 256 or 512 bytes.
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TN-29-63
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2010/10
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486.67 KB
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Software Device Drivers for Small Page Micron NAND Flash Memory: This technical note explains how to use the Micron small page NAND Flash memory software drivers.
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TN-29-64
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2010/10
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889.73 KB
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Software Device Drivers for Very Large Page Micron NAND Flash Memory: This technical note explains how to use the Micron very large page NAND Flash memory software device drivers.
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TN-29-65
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2010/10
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405.64 KB
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Enabling Software BCH Error Correction Code (ECC) on a Linux Platform: This technical note addresses applications using existing 1-bit ECC processors to enable Micron MT29F1GxxABxDA, MT29F2GxxABxEA, MT29F4GxxABxDA, and MT29F1GXXABXEA NAND Flash memory devices with software BCH ECC.
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TN-29-71
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2012/04
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688.7 KB
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技术要点
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