SoC, SiP, PoP, MCP?Choose the Right Die-Stacking Solution

What are your PoP/MCP offerings for x8 NAND and/or x16 Mobile LPDDR?

Our standard offerings are x16 NAND and x32 Mobile LPDDR.We also have x8 NAND and x16 Mobile LPDDR.For the most current information, contact your local Micron support.

We designed in discrete parts, but now we are using PoP parts.They appear to be limited in what speeds we can achieve.What is the problem?

When moving from testing with discrete parts to PoP, care should be taken that no stubs are left from the design containing the discrete components.If needed, a 0 Ohm resistor could isolate the memory from the traces used for the discrete part.

Our contract manufacturer has little experience with PoP. Why should we try something new?

The market is driving the requirement for the smaller PoP form factor, and several contract manufacturers have already enabled this technology.PoP can help save in routing costs and improve signal integrity.Given those cost and performance advantages, Micron recommends that you work very closely with your CM to ensure a good transition to this technology.Micron worked closely with Texas Instruments (TI) on the technical notes PCB Design Guidelines Part I and PCB Assembly Guidelines Part II. These can also help provide guidelines to help you work with your CM for the best success on your conversion to PoP.

What is an MCP?What is a PoP?What is the difference between the two devices?

MCP is multichip package that contains multiple die and can be used by any controller.PoP is a form of an MCP made specifically to stack on top of a processor that has pads on the top side that mate to the ballout of the PoP. Because the PoP package stacks right on top of the processor, it eliminates the need to have traces routed on the PCB and provides better signal integrity.A variety of PoP packages are designed for various processors.PoP and MCP devices give designers the ability to take advantage of z space and to provide the flexibility to offer different logic in one package (for example, NAND + Mobile LPDDR or e-MMC™ + NAND + Mobile LPDDR).We have a wide selection of offerings to meet our customer’s needs.

What PoP/MCP parts have been validated with the OMAP35x?

Micron works closely with Texas Instruments (TI) to validate and optimize our parts for the OMAP35x processors.As we work with the OMAP35x team, the list of validated memory devices expands frequently.For the most current information, contact your local Micron support, or contact Micron Product Technical Support.Be sure to select MCP for the quickest response time.

What parts have been validated for TI OMAP processors?

Micron works closely with Texas Instruments (TI) to validate and optimize our parts for the OMAP35x processors.As we work with the OMAP35x team, the list of validated memory devices expands frequently.For the most current information, contact your local Micron support, or send an e-mail to mcpsupport@micron.com.

What is the maximum amount of memory that Micron can support on the OMAP35x processors?

Micron works closely with Texas Instruments (TI) to validate and optimize our parts for the OMAP35x processors.As we work with the OMAP35x team, the list of validated memory devices expands frequently.For the most current information, contact your local Micron support, or send an e-mail to mcpsupport@micron.com.

Do you have any reliability data on the PoP?

Yes. We do have reliability data on the PoP. Contact Micron for more information.

Do I use only Mobile LPDDR with the OMAP35x, or can I use a standard SDR/DDR/DDR2/DDR3 part?

The OMAP35x is only compatible with Mobile LPDRAM.Standard SDR/DDR/DDR2/DDR3 is not supported.

Can I use a discrete package with the OMAP35x?

The PoP versions of the OMAP35x (package designations, CBC and CBB) are specifically designed to take advantage of the PoP interface for the NAND and Mobile LPDDR signals through the top of the OMAP package.However, you can route the NAND and Mobile LPDDR signals out of the bottom of the OMAP to a discrete package.The nonPoP OMAP35x package (package designation CUS) is specifically designed to use discrete memory packages.

For a PoP/MCP, does the qualification testing at the factory differ from testing on the discrete components?

No. the PoP/MCP parts undergo the same qualification testing as the discrete components.

I’ve heard that opting for a PoP/MCP solution is more expensive than using discretes, so why should I use it?

From a system-solution perspective, because the PoP mates directly onto the processor, it eliminates the need to have traces routed on the PCB.This saves costs for the customer, as well as provides better signal integrity.

I am using the Logic Zoom OMAP35x kit.What is the Micron part number for the part used on this platform?

The Logic Zoom OMAP35x kit uses our NAND + Mobile LPDDR PoP combination parts, and the densities vary depending on which Logic Zoom OMAP35x kit that you have.Type the second 5-digit alphanumeric code on the physical part into our FBGA Decoder, which will provide you with the corresponding Micron part number.

How do I know the Micron part number for the part on the Beagle Board?

The Beagle Board uses our NAND + Mobile LPDDR PoP combination parts, and the densities vary depending on which version of the Beagle Board you have.Type the second 5-digit alphanumeric code on the physical part into our FBGA Decoder, which will provide you with the corresponding Micron part number.