e-MMC

emmc

瞄准 MMC

我们的 e·MMC™ 嵌入存储将大容量 NAND 闪存设备与高速 MMC 控制器整合在一个封装中。了解如何使用此款高性价比嵌入存储获得您所需要的性能和可靠度，同时实现快速进入市场。

专为移动多媒体设计的 NAND 闪存

超大容量存储
我们的 e·MMC 嵌入式存储将优质低价的 NAND 闪存与兼容 JEDEC 的 MMC 高速控制器整合在一个小巧的 BGA 封装中。此单片封装解决方案很适合需要类似 MMC、应用到应用的互用性的设计师。And because we manufacture the NAND, we can offer e·MMC solutions in a variety of densities and options; contact us for inquiries and more information.

e·MMC 文档

便于设计

我们的 e·MMC 嵌入式存储实际上将类似 NAND 闪存的编程/擦除/读取设备转换成了简单的读/写存储。这种托管接口使用误差校正码 (ECC)、损耗平衡以及损坏区块管理技术，在内部解决了可能出现的 NAND 设计问题。在内部解决错误缓解了主控制器的负担并提高了速度，从而带来更高系统性能。

nand compar

精简的开发和认证
e·MMC 嵌入存储还具备标准接口规格，最大化减轻主软件对过程节点迁移和供应商 NAND 闪存特性的不适应，从而简化了硬件和软件的整合。此解决方案应用独立技术并且具备统一规格，减少了开发和认证流程以及在目前和未来的 NAND 设备中进行设计的复杂性。

其他主要优势

更好地过渡到多层单元 (MLC)
从 SLC NAND 完美过渡到多层单元 (MLC) NAND。

简便的 BGA 封装
为硬件和软件开发节约了大量资源。

高性能控制器
为处理器减少了一些低级任务的负担。

标准接口规格
受到了大多数移动应用顾客和设计师的支持，并且兼容 MMC 规范。

 特点 优势
Package JEDEC-standard, compliant with the MMC specification Eases the design and validation process
Voltage 1.8V Vcc (1.8V I/O) Low voltage extends battery life in mobile devices
1.8V Vcc (1.8V I/O)
密度 4GB–32GB Wide density range
Speed High speed:up to 52 MB/s Provides higher system performance
温度范围 25°C to +85°C Ideal for rugged environments
-40C to +85C
Internal Error Correction ECC Takes the burden off host controller and increases speed

Simplifying High-Capacity Storage for Mobile and Embedded Systems
Our e·MMC embedded memory simplifies high-capacity storage issues and eases the load that many wireless processors carry in mobile designs.It also capitalizes on MLC strengths, improving overall system-level performance.Find out how in our e·MMC white paper.
Download the white paper

Choosing the Right NAND
Understanding the advantages that each of the various NAND Flash memory types offers is important if you’re going to find the best possible solution for your application.To help, we’ve developed a Choosing the Right NAND guide, which offers a basic overview of the various NAND Flash options, enumerating the features and benefits of each.
View the guide

类型 安全 标题和描述 编号 更新日期 文件大小
IBIS Behavioral Models: 美光多年前就已成为 IBIS 开放论坛的一员，完全支持 IBIS 规范。美光的网站上提供其大部分产品的 IBIS 模型以供下载。 TN-00-07 2009/11 163.98 KB
Thermal Applications: 定义了测量和确保美光零件和模块不超过允许的最高温度的一般方法和标准 TN-00-08 2010/05 252.18 KB
Recommended Soldering Parameters: 定义了美光科技公司产品的推荐连接技术和参数。 TN-00-15 2007/03 69.09 KB
Uprating of Semiconductors for High-Temperature Applications: 描述了与提升温度有关的问题，以及在制造环境规范之外使用零件和/或系统的相关风险 TN-00-18 2010/05 428.33 KB
Understanding Signal Integrity: 描述了从新产品构思直至产品寿命结束的整个过程中，如何发挥内存设计、测试和验证工具的最大优势 TN-00-20 2009/12 1.52 MB
PCN/EOL Systems: 介绍了美光产品的变更通知和寿命终结系统。 CSN-12 2012/04 79.21 KB
Wafer Packaging and Packaging Materials: 提供了有关装运美光产品时使用的各种材料的完整装运和回收信息。 CSN-20 2011/09 776.24 KB
Bare Die SiPs and MCMs: 描述了 Bare Die SiP 和 MCM 的设计考虑因素。 CSN-18 2009/04 151.06 KB
Shipping Quantities: 提供了料件数量表格。 CSN-04 2012/04 472.27 KB
Micron KGD Definitions: 描述了美光 KGD-C1 和 KGD-C2 DRAM 芯片的测试规格和参数 CSN-22 2009/07 65.52 KB
Micron Component and Module Packaging: 解释了美光的封装标签和程序。 CSN-16 2012/02 887.13 KB
ESD Precautions for Die/Wafer Handling and Assembly: 介绍了在工作场所中控制 ESD 的好处，包括提高产量和改善质量与可靠性，最终可以缩减制造成本。 CSN-24 2010/08 119.08 KB
Electronic Data Interchange: 描述了 EDI 传输的装置、协议和联系方式。 CSN-06 2005/09 53.5 KB
RMA Procedures for Packaged Product and Bare Die Devices: 概括介绍了标准的退货授权 (RMA) 程序，以及与 bare die RMA 的对比。 CSN-07 2010/10 82.64 KB
ISO System Management Standards: 描述了 ISO 系统管理标准。 CSN-08 2004/04 39.18 KB
Moisture Absorption in Plastic Packages: Describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture TN-00-01 2010/02 87.26 KB
Accelerate Design Cycles with Simulation Models: 美光会提供必要的工具和指导，以在实际布局前对新设计进行检验。此技术要点讨论了软件模型支持、信号保真性优化和逻辑电路设计。 TN-00-09 2010/02 206.91 KB
Micron Wire-Bonding Techniques: 此技术要点提供了丝焊技术的指导，可用于美光产品的镍钯 (NiPd) 和铝制接合焊盘。 TN-00-22 2010/11 66.13 KB
TN-10-21:Qualcomm QSC6695 Validation Report: Rev. 1.0 2011/12 336.51 KB
TN-10-21:Qualcomm QSC6695 Register Settings: Rev. 1.0 2011/12 482.14 KB
PoP User Guide: Provides several well-established guidelines for package-on-package (PoP) semiconductor package design and assembly, which requires unique considerations in both the up-front design and the manufacturing process. CSN-34 2011/08 846.18 KB
Micron BGA Manufacturer's User Guide: 提供相关信息，帮助顾客轻松将最前沿的和传统的美光球栅阵列 (BGA) 封装整合到制造流程中。此指南旨在提供一系列高水平指导，并附有参考手册，其中介绍了封装相关和制造工艺流程的典型做法。 CSN-33 2011/07 353.32 KB
Product Marks/Product and Packaging Labels: 介绍了产品料件的标记，以及产品和封装的标签。 CSN-11 2012/04 724.89 KB
Micron e-MMC Embedded Memory: Micron's e·MMC embedded memory combines our high-quality,low-cost NAND Flash memory with a high-speed MultiMediaCard (MMC) controller in a low-profile BGA package. 产品宣传页 2012/02 163.15 KB
MCP Product Flyer: An overview of how Micron's MCPs deliver the right combination of form factor, speed, and power. 产品宣传页 2012/03 155.96 KB
Bypass Capacitor Selection for High-Speed Designs: 描述了高速设计的旁路电容选择。 TN-00-06 2011/03 481.9 KB
e·MMC Linux Enablement: This technical note describes supported and unsupported e·MMC features and how to enable them in Linux.It includes a discussion of the e·MMC standard (4.41) introduced in March 2010. TN-52-05 2012/03 299.97 KB
TN-52-07 eMMC Partitioning: This technical note is a guide for partitioning an eMMC device according to the 4.41 version of the JEDEC specification.It discusses how to set a physical partition configuration, how to set a general or enhanced partition, and how to access a partition, as well as a detailed explanation of the registers used in partitioning. TN-52-07 2012/05 206.47 KB

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We have an SD/MMC card socket but don’t have a BGA socket to evaluate an eMMC device.Can we evaluate a Micron eMMC device?
Yes, Micron can provide a small board with a mounted BGA device that can fit into an SD/MMC standard card socket for use in evaluation.
What is the purpose of ROD resister?Why do we need to prepare ROD and RCMD on command line?
ROD resister is only used during the card identification period to support 400 kHz clock operation.During this period, the device uses an open drain driver which does not have pull-up capability.The host needs to have strong pull-up capability to operate the command line at 400 kHz.This must be disconnected after the card identification period.RCMD is used to keep the command line high when there is no transaction on the command line.If the host does not have ROD, the RCMD can be used instead.However, the maximum operating frequency during the card identification mode must be reduced.
We have an MMC host controller which supports v4.1 or earlier.Can we use a v4.2 eMMC device?
Yes, if the device density is up to 2GB.However, for 4GB and higher densities, you need to have the v4.2 MMC driver software in your system, because the device uses sector address mode which is defined in the v4.2 specification.
Does Micron eMMC support SPI mode?
Unfortunately, Micron eMMC does not support SPI mode.The JEDEC eMMC standard specification removed this functionality from the v4.3 specification.
Is v4.4 eMMC function backward compatible to v4.2 function?
Yes, v4.4 function is backward compatible to v4.2 function.The v4.2 MMC host can use the v4.4 eMMC device with v4.2 functionality.The v4.4 device has several additional features which are suitable for secure boot applications from eMMC devices.

e-MMC

相关信息

MCP